Dholera (Gujarat), March 13th: Prime Minister Narendra Modi emphasized India’s commitment to delivering on its promises, particularly in transforming the nation into a semiconductor manufacturing hub. Addressing the public virtually, Modi laid the foundation stone for three semiconductor facilities worth approximately Rs 1.25 lakh crore, with two situated in Gujarat and one in Assam.
“This marks a monumental stride towards a promising future,” remarked Modi, underscoring the significance of the occasion. He highlighted the importance of ‘Made in India’ semiconductor chips in fostering self-reliance and technological advancement.
Modi reiterated, “When India makes a commitment, it follows through, as does democracy.” He contrasted this commitment with previous administrations, which, he claimed, were mired in corruption scandals and failed to invest significantly in semiconductor industry development.
The three semiconductor projects launched include India’s first Fab facility in Dholera, Gujarat, an Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, and another OSAT facility in Morigaon, Assam.
